Round 3 Workshop of HKUST-Sino One Million Dollar Entrepreneurship Competition 2022 on Youthquake, Entrepreneurship and Social Mobility

25 April 2022 (Monday), 4:00 – 5:00pm
Session Details
25 Apr 2022 16:00 - 17:00
Program Details

Deadline :
25 Apr 2022 17:00

Enquiry Email :

Organised by :
HKUST Entrepreneurship Center

For the upcoming workshop series for HKUST-Sino One Million Dollar Entrepreneurship Competition 2022, we are excited to have Prof. Yan XU to speak about his recent report for the framework on technology and innovation development in Hong Kong. 


The focus of this workshop will be on youthquake and entrepreneurship, which is about characteristics of the young generation, the millennium generation in particular, and highlight why entrepreneurship is preferred by the young generation. Also, he will add a few points about innovation and upward social mobility. 


Join us and don’t miss this chance to gain some valuable insight for running your team and start-up. Besides, it will be a vital lesson for those who are target millennium as customer as well.


Please see the below details for the workshop:

Topic: Youthquake, Entrepreneurship and Social Mobility

Date and Time: 25 April 2022 (Monday), 4:00 – 5:00pm

Venue: Online via Zoom (Click here to join)

Meeting ID: 965 2941 6580

Passcode: 335375


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Prof. Yan XU

Associate Dean of Business and Management (HKUST EMBA Program, Executive Programs and China Strategy)

Department of Information Systems, Business Statistics and Operations Management

Associate Director of Center for Business Strategy and Innovation


Prof. Yan Xu received his PhD in Telecommunications Policy from the University of Strathclyde in 1997 and joined HKUST in the same year. His research areas are innovation management and policy, competitive strategy, and regulatory policy of telecommunications. His current research project is on innovation and its impact on upward social mobility.


For details of the competition, please refer to our website. And free feel to ask questions via