MEMSI 2025 - Smart Airport Challenge
Deadline :
22 Nov 2024 23:59
Enquiry Email :
hkinnovationnode@mit.edu
Organised by :
Hong Kong MIT Innovation Node
Join MEMSI (MIT Entrepreneurship and Maker Skills Integrator) to unleash your inner entrepreneur, network with industry domain experts to innovate for the aviation sector and turn ideas into products that matter!
MEMSI 2025 (January 13-25, 2025) is a two-week, intensive venture bootcamp for aspiring entrepreneurs who attend MIT or universities in Hong Kong. The in-person program is designed for those who want to advance their skills in entrepreneurship, prototyping, product development and business modeling with fellow innovators across geographies. We will be partnering with the Hong Kong International Airport to design for accessibility.
We are recruiting students across broad fields of business, computer engineering, data analytics, UX/UI design and more, with a preference for Year 3 undergraduates and above (including postgraduate level, incoming or current Master’s students and PhD’s). You must be a current student pursuing a full-time degree bearing program at one of the UGC universities to be eligible.
Learn more and apply at our program website: https://memsi.mit.edu/.
Application deadline for Hong Kong students: November 22, 2024 (rolling basis)
Don't miss out on this incredible opportunity!
Email hkinnovationnode@mit.edu for enquiries.