MIT Node: SustainabilityHACK 2024 (2-day hackathon)

31 May - 1 Jun, 2024
Session Details
31 May 2024 08:00 - 1 Jun 2024 23:59
Program Details

Deadline :
10 May 2024 12:00

Enquiry Email :

Organised by :
MIT Hong Kong Innovation Node

Did you know? The buildings and construction sector is by far the largest emitter of greenhouse gases, accounting for a staggering 37% of global emissions, according to UN Environment Programme. 

Powered by the MIT Node, make an impact with industry practitioners and like-minded peers to design a more sustainable future:

  • Improving safety and wellbeing practices in the workplace 
  • Reinforcing the circular economy to reduce and recycle waste, and reuse building materials
  • Introduce new energy solutions in the construction life cycle

Supported by HKPC Inno Space and The Construction Industry Council, SustainabilityHACK 2024 invites the community to explore ways to build processes and practices for “Sustainable Construction”, through innovative new ideas and adoption of new technologies.


Join us as we unite innovators to reimagine a sustinable construction culture, and to improve safety and wellbeing practices in the workplace.

Open to the general public! Pitch your idea for a chance to win cash prizes totalling HK$50,000!

Event Details:

Date: May 31 – Jun 1, 2024

This 2-day in-person hackathon welcomes university students and professionals with diverse backgrounds across all disciplines. Teams will be divided into two tracks: 1) Ideation and 2) Early Stage Start Up. 

May 27, 28, 29 & 30, 2024

Join our online speaker events during the week leading up to the hackathon plus an optional in-person Team Formation Mixer on May 30.

Venue: 1/F, MIT Hong Kong Innovation Node, Hong Kong Productivity Council, 78 Tat Chee Ave, Kowloon Tong 


Applications will be considered on a rolling basis until 12 pm on Friday, May 10, 2024

Join us to gain: 

  • Exclusive mentorship & industry network
  • A chance to win cash prizes 
  • A platform to showcase innovative ideas

Apply as applicant:


For more information about the program: